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Developing device×エイ・エス・エイ・ピイ - List of Manufacturers, Suppliers, Companies and Products

Developing device Product List

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Liftoff (Image Reversal) Compatible Photoresist Development Equipment

Proven results with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.

The product is equipped with sheet-type development, front exposure (reverse exposure), baking, and cooling functions. We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including TMAH. 【Features】 ■ Achieves low prices ■ Automatic size recognition ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

  • Resist Device

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1 Fluid Spray Type Automatic Photoresist Developer

It is a single-fluid developing device that is effective in reducing the development and processing time of thick films. You can freely choose the spray shape (circular, fan, etc.), pressure, and flow rate.

It is a single-fluid spray-type developing device. Since the spray is generated by the pressure of the developing solution, mist from the spray is less likely to scatter, and it can also speed up the developing process. It is optimal for developing large substrates and thick films. The spray nozzle can be freely selected in terms of shape (such as fan-shaped or circular), distribution, spreading angle, and range. This product is equipped with developing, baking, and cooling functions in a sheet-fed format. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we have achieved low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals, including TMAH. 【Features】 ■ Equipped with single-fluid spray (can be used in conjunction with paddles) ■ Automatic wafer size recognition ■ Reduced footprint ■ Lineup tailored to production volume We have a demo setup available, so please consider scheduling a demonstration!

  • Resist Device

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2-fluid spray type automatic photoresist developing device (developer)

From high pressure to mist-like soft pressure, it's all under control! A two-fluid spray resist development device. It is effective in shortening the development time for thick films and more.

This is a developing device that uses a two-fluid spray method to mix and discharge N2 and developer solution. By changing the pressure of N2, the discharge pressure of the spray can be adjusted. You can choose from a wide range of spray discharge patterns, such as increasing the liquid pressure for high-pressure discharge or reducing the liquid volume to create a fine mist for a softer discharge. The spray nozzle can be freely selected in various shapes such as fan-shaped or circular, as well as the distribution, spread angle, and range. We offer a lineup that matches production volume, from manual to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Equipped with a two-fluid spray! (Paddle can also be used) ■ Automatic wafer size recognition function ■ Proven track record with various chemicals ■ Compact design ■ Lineup tailored to production volume We have a permanent demo setup, so please consider scheduling a demonstration!

  • Resist Device

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Static development type (paddle) automatic photoresist development device (developer)

We have a proven track record with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.

The development is performed by pooling the developer solution on the wafer in a batch process. Unlike the dip method, each wafer is developed individually, resulting in very high reproducibility of the process. By optimizing the amount of chemical used, it leads to a reduction in the amount of developer solution used. We can accommodate requests for pooling methods, from shower types to straight nozzles. It also features a shaking function during static development! (It moves the liquid by repeating low rotation and stopping.) The batch process includes development, rinsing, baking, and cooling functions. We design, manufacture, and sell according to customer needs and production volumes. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ High reproducibility of development results ■ Reduction in chemical usage ■ Automatic wafer size recognition ■ Proven track record with various chemicals ■ Reduced footprint ■ Design tailored to production volume We have a permanent demo setup, so please consider a demonstration!

  • Resist Device

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Automatic photoresist coating and developing equipment (coater-developer)

Compatible with low to high viscosity resists! We can manufacture equipment for any wafer size, from small diameter to large diameter!

【Features】 ■ Achieves low price ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Compatible with sizes from 2 to 12 inches ■ Capable of processing multiple wafer sizes (e.g., compatible with 3, 4, 5 inches and 8, 12 inches) ■ Automatic wafer size recognition system ■ Proven performance with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options available with resist reduction ■ Lineup tailored to production volume 【ASAP Coater/Developer Functions】 ● Spin coating ● HMDS treatment ● Baking ● Cooling ● Developing ● Rinsing We have achieved low prices by handling everything from design to manufacturing and sales in-house! 【ASAP Features and Achievements】 ● Proven use of a variety of chemicals including positive and negative resists, polyimide, SOG, WAX, silicone, etc. ● Extensive experience in substrate transport including Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, SiO2 (glass), etc. ● Numerous transport achievements with thin substrates such as GaAs (thickness 150um), InP (thickness 150um), LT (thickness 120um)! *For more details, please refer to the PDF document or feel free to contact us.

  • Coater
  • Resist Device
  • Other semiconductor manufacturing equipment

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Semi-automatic photoresist developing equipment (semi-auto developer)

It is a semi-automatic developer for customers who do not have a high enough production volume to purchase a fully automated machine but seek process reproducibility.

This product is equipped with a sheet-fed development, baking, and cooling unit. It is recommended for customers who have a production volume that is not high enough to introduce an automatic machine, but cannot adopt a manual machine due to labor issues! We design and manufacture semi-automatic machines tailored to your needs, so if you are having trouble introducing new equipment, please consider us! We have a proven track record with various chemicals such as TMAH. 【Features】 ■ Automatic transport function ■ Achieves low cost ■ Proven track record with various chemicals ■ Reduced footprint *Please feel free to contact us for more details.

  • Resist Device

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Compact! Manual photoresist developing device (manual developer)

It is a compact resist development system for small-lot, multi-variety production and development applications. Unlike DIP, it can stabilize quality due to its sheet-fed design.

This product is a manual sheet-type developing machine. It features a compact design that combines the chemical solution box and processing cup into one unit. We design, manufacture, and sell manual machines tailored to our customers' needs. It is used not only for research and development purposes but also by customers handling small quantities of diverse products. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Achieves low cost ■ Compact! ■ Options for paddle, single fluid spray, and dual fluid spray ■ Proven performance with a variety of chemicals *For more details, please refer to the PDF document or feel free to contact us.

  • Resist Device

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Maintain a constant reverse taper angle! PEB-compatible resist development equipment (developer)

Keep the negative taper angle constant! This is an automatic resist development system compatible with post-exposure bake (PEB) required for negative resist and image reversal resist.

Equipped with sheet-type development, full exposure (inverted exposure, image reversal), baking, and cooling functions. An important PEB that determines the angle of the reverse taper using lift-off resist. Our proprietary program stabilizes the reverse taper angle! Additionally, using it for baking after exposing negative resist achieves a stable process. With a lineup tailored to production volume, from manual machines to fully automatic machines, we have realized low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals such as TMAH, colin aqueous solution, and Na2CO3. We also have numerous achievements with thin wafers (such as wafer thickness of 150um), so please feel free to consult us. 【Features】 ■ Stability of reverse taper angle through PEB ■ Automatic wafer size recognition function ■ Compatible with paddle, single-fluid spray, and dual-fluid spray ■ Reduced footprint ■ Lineup tailored to production volume We also have demo equipment available, so please consider scheduling a demonstration!

  • Resist Device

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Automatic resist coating and developing equipment for corner substrates (coater-developer)

Supports low to high viscosity resist! Equipment can be manufactured for any wafer size!

The product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! We have a proven track record with a variety of chemicals including positive-negative resist, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and ceramic, as well as SiO2 (glass). We have numerous achievements in transporting thin substrates and square substrates, such as GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features】 ■ Achieves low prices ■ Capable of handling low to high viscosity (1.7cP to 10000cP) ■ Uniform film distribution through a rotating cup coating method ■ Compatible with 2 to 12 inches ■ Capable of processing multiple types of wafers (compatible with 3, 4, and 5 inches) ■ Automatic recognition of wafer size ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.

  • Coater

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